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Micro-Chem, Inc. offers a wide range of applications for either large runs or quick-turn prototype circuit boards.
We have designed a series of discreet process techniques to maximize the efficiency and reliability of your product.
We offer a wide variety of plating applications including electroplate copper, tin/lead, tin, nickel, silver and gold. Electroless plating includes gold, silver, tin, nickel, copper, alodyne, and black oxide. We also specialize in thru hole plating and edge plating of all PTFE laminates including heavy metal-backed copper, brass and aluminum.
Micro-Chem, Inc. also offers hot air leveling, silkscreen, and soldermask applications.
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